Dr. Shubhra Bansal
Principal Investigator

Based at Purdue University in West Lafayette IN, Bansal research group applies computational and experimental research approaches to address materials integration and reliability challenges in Energy Conversion and Advanced Semiconductor Packaging. Our group includes members from the School of Mechanical Engineering and the School of Materials Engineering at Purdue University. As an educator, I firmly believe in the training and development of students as my primary purpose, and I contribute towards overcoming workforce development challenges for US-based Manufacturing.

Our current research projects include:

• Dimensionally modified halide perovskites and chalcogenides for photovoltaic devices and detectors. Key material systems we are working with are halide perovskites and 2D-TMDCs.
• 2D and Hierarchical materials for next generation fine-pitch interconnects for advanced semiconductor packaging
  • Interface control for low temperature hybrid bonding for sub 5 m pitch chip-to-substrate interconnects
  • Interface control to enhance reliability of sub 1 m L/S redistribution layers
  • Barrier and capping materials for improved interconnect reliability (TSV, TGV, etc.), redistribution layers, etc.
  • Advanced substrate or interposer materials
• Materials innovations for thermal management and waste heat recovery
  • Degradation kinetics of thermal interface materials (TIMs) for immersion cooling of data centers
  • Thermo-photonic and thermo-electric cooling of hotspots and waste heat recovery in 3D-HI microsystems.
• Combinatorial reliability studies with in-situ multi-modal characterization

I am also dedicated to curriculum development, AI-based learning methodologies and workforce development as the Lead of Heterogeneous Integration and Advanced Packaging technical vertical for DOD SCALE program.